|
|
|
|
|
TOKYO, June 28, 2010 - (ACN Newswire) - NEC Corporation (NEC; TSE: 6701), a leading network, communications and information technology company, announced today the development of technologies that enable quick and accurate simulations of warping package boards as well as the behavior of solder bumps that result from the reflow process.
These simulation technologies use multi-layer beam theory (*1) to quickly estimate the warping that takes place in the high temperature reflow process for semiconductor device packages. The behavior of molten solder bumps can be visualized with a particle modeling that uses the molecular dynamics method (*2). This visualization of molten soldering is used for quick warping estimations, in which the simulated shapes of molten soldering are used to accurately implement the actual shape of the soldering, which results in highly reliable connection design techniques.
These technologies also enable technicians to reproduce and analyze simulations of the primary factors behind failed soldering connections (failed, thin, short connections, etc.) and to optimize the production processes and the structures of devices. Therefore, these technologies enable overall development to be improved by reducing the number of manufacturing test trials, improving the reliability of soldered connections through augmented structural designs and enhancing the yield rate from manufacturing process designs.
These newly developed simulation technologies feature the following:
1.Fast estimation of package warping that takes place during the reflow process
The multi-layer beam theory is used in order to achieve fast estimation of the warping that takes place on multi-layered packages during the LSI package manufacturing processes. The time required for one round of analysis of multi-layer beams of whole packages exposed to temperature changes has been reduced to anywhere from 1/60 to 1/90 of the time that is required when using the conventional finite element method (FEM, *3) of analyzing the minute warping of net grids. This has resulted in the analysis of a wide variety of design conditions and the ability to quickly identify the optimum multi-layer structure and reflow conditions. Moreover, these technologies may be applied in order to estimate the warping of printed circuit boards.
2.Visualization of molten soldering through the molecular dynamics method
These technologies enable robust and easily managed liquid solder droplet simulations by treating them as aggregations of particles, which represents a part of solder, within the molecular dynamics method, which is difficult to simulate using the meshing method due to high calculation costs and modeling skills. These technologies also facilitate the visualization of molten soldering throughout varying temperatures of the reflow process package warping.
Recent increases in the density of electronics equipment have been characterized by packages for semiconductors and other devices that feature thinner, multi-terminal and narrow pitches. Additionally, the introduction of lead-free soldering with a high melting point and low wettablity has caused the failure of soldering connections and increased package warping in the reflow process.
Presently, the skill and experience of veteran technicians are relied on for the structural and manufacturing process design of soldered connecting parts for thin mobile electronics. However, as the progress of multi-function devices has made packages more complex and diversified, it has become increasingly difficult with these traditional methods to produce optimal designs. Furthermore, the demand is growing for analysis technologies that support structure and manufacturing process design due to the need for assuring the quality of solder connections of LSI packages, shortening the lead time for the design process, and reducing development costs.
These simulation technologies were developed in response to these evolving needs of world markets. Looking forward, NEC will continue to proactively drive the wide-spread use of simulation technologies in support of highly reliable hardware product design.
*1) Multi-layer Beam Theory:
Multi-layer beam theory treats printed circuit boards and packages as a multi-layer beam and estimates the stress, strain, and warping due to temperature changes.
*2) Molecular Dynamics Method
The Molecular dynamics method applies Newton's equation of motion (F=ma) to each particle and numerically tracks the movement (position, speed, strength) of each particle.
*3) Finite Element Method (FEM):
FEM is a numerical analysis method to approximately solve differential equations. This method estimates the entire behavior of objects that possesses complex shapes/properties by partitioning them into approximations of simple small areas (components).
Contact:
Joseph Jasper
NEC Corporation
+81-3-3798-6511
E-Mail: j-jasper@ax.jp.nec.com
Topic: Press release summary
Source: NEC Corporation
Sectors: Electronics, IT Individual
https://www.acnnewswire.com
From the Asia Corporate News Network
Copyright © 2024 ACN Newswire. All rights reserved. A division of Asia Corporate News Network.
|
|
|
|
|
|
|
|
