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| Wednesday, March 12, 2025 |
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TANAKA PRECIOUS METAL TECHNOLOGIES開發出適用於第5代訊號繼電器的次世代接點「極小CROSS BAR接點（帶狀接點）」 |
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TANAKA PRECIOUS METAL TECHNOLOGIES已开发了面向第5代信号继电器的次世代接点 “微小CROSS BAR接点（异型材带状接点）” |
| 开展TANAKA的工业用贵金属业务的TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd.（总公司：东京都中央区、执行总裁：田中 浩一朗）宣布成功开发出了面向第5代信号继电器的次世代接点“微小CROSS BAR接点（异型材带状接点）”。本产品作为面向第5代的带状接点，带宽达到0.2毫米的更小尺寸。 more info >> |
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TANAKA PRECIOUS METAL TECHNOLOGIES Develops Miniaturized Micro Profile, a Next-Generation Contact tape for Fifth-Generation Signal Relays |
| TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. (Head Office: Chuo-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), a company engaged in the industrial precious metals business of TANAKA, announces the development of its miniaturized micro profile tape, a next-generation contact for fifth-generation signal relays. more info >> |
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| Friday, February 7, 2025 |
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TANAKA to Provide Medals for the Tokyo Marathon 2025 That Represent All the Participants in the Event with Woven Lines |
| TANAKA PRECIOUS METAL GROUP Co., Ltd. (Head Office: Chuo-ku, Tokyo; Group CEO: Koichiro Tanaka) will provide and donate gold, silver, and bronze medals to the top three men and women finishers of the marathon and wheelchair marathon events at the Tokyo Marathon 2025. more info >> |
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| Friday, January 31, 2025 |
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TANAKA PRECIOUS METAL TECHNOLOGIES Launches Visi Fine(R): A Group of Precious Metal Materials for Medical Device Components |
| TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. (Head Office: Chuo-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), a company engaged in the industrial precious metals business of TANAKA, announces the launch of its Visi Fine(R) series, a group of highly radiopaque precious metal materials, including platinum (Pt) alloy wire. more info >> |
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| Thursday, January 23, 2025 |
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다나까귀금속공업, 전력반도체용 시트형상 접합 재료 ‘AgSn TLP 시트’ 개발 |
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田中貴金屬工業開發出適用於功率半導體的片狀接合材料「AgSn TLP片」 |
| 以田中貴金屬的產業用貴金屬展開事業的田中貴金屬工業株式會社（總公司：東京都中央區，執行總裁：田中 浩一朗）宣布開發出用在功率半導體封裝製造中，晶片貼裝的片狀接合材料「AgSn TLP片」。本產品除了功率半導體的晶片貼裝用途之外，還有望推廣到散熱器中進行大面積接合，作為熱界面材料（TIM材料）（※1）的替代材料。 more info >> |
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田中贵金属工业开发了面向功率半导体的片状接合材料“AgSn TLP片” |
| 开展田中贵金属的工业用贵金属业务的田中贵金属工业株式会社（总公司：东京都中央区、执行总裁：田中 浩一朗）宣布成功开发出了功率半导体封装制造中用于芯片贴装的片状接合材料“AgSn TLP片”。该产品除了用于功率半导体的芯片贴装之外，还有望作为热界面材料（TIM材料）(※1)的替代材料扩展应用到散热件的大面积接合上。 more info >> |
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TANAKA PRECIOUS METAL TECHNOLOGIES Develops AgSn TLP Sheet, a Sheet-type Bonding Material for Power Semiconductors |
| TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. (Head Office: Chuo-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), which engages in the industrial precious metals business of TANAKA, has announced the development of the AgSn TLP sheet, a sheet-type bonding material designed for die attachment in the manufacturing of power semiconductor packages. more info >> |
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| Wednesday, January 15, 2025 |
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TANAKA's Group Company EEJA to Exhibit at 39th NEPCON JAPAN |
| EEJA Ltd. (Headquarter: Chuo-ku, Tokyo; CEO: Akihiko Domae; hereafter "EEJA"), the main company operating TANAKA's plating business, announced today that it would exhibit at the 39th NEPCON JAPAN, the electronics development and packaging exhibition scheduled to be held at Tokyo Big Sight from January 22-24, 2025. more info >> |
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