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Tuesday, July 28, 2015
일본 일렉트로플레이팅 엔지니어스(EEJA), 대량생산 기계와 동일한 도금 형성이가능한 반도체 웨이퍼 컵식 초소형 도금 실험장치를 7월 15일부터 판매 개시
日本電鍍工程株式會社(EEJA)於7月15日開始販售可形成和量產機型相同電鍍層的半導體晶圓鍍杯式超小型電鍍實驗裝置
日本电镀工程株式会社(EEJA)于7月15日开始销售可形成和量产机型相同电镀层的半导体晶圆杯式超小型电镀实验设备
Thursday, July 16, 2015
Correction: Electroplating Engineers of Japan Launches Semiconductor Wafer Cup-type Ultra-compact Plating Laboratory Equipment on July 15, Enabling Plating Equivalent to Mass Production Machines
Wednesday, July 15, 2015
Electroplating Engineers of Japan Launches Semiconductor Wafer Cup-type Ultra-compact Plating Laboratory Equipment on July 15, Enabling Plating Equivalent to Mass Production Machines
Wednesday, April 22, 2015
이트륨계 초전도 선재용, 구리 배향 금속 기판의 대량생산 체제를 확립
確立釔系超電導線材用銅配向金屬基板的量產體制
确立钇系超电导线材用铜配向金属基板的量产体制
Wednesday, April 8, 2015
Tanaka Kikinzoku Kogyo K.K. Approved as a Full Member of The London Platinum & Palladium Market (LPPM)
Tuesday, April 7, 2015
Establishment of Mass Production System for Textured Cu Metal Substrates Using YBCO Superconducting Wire

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