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Tuesday, July 12, 2011
다나까 귀금속 그룹과 SUSS MicroTec, 서브마이크론 금 입자의 패턴 전사 및 접합 기술을 공동 개발
田中贵金属工业与休斯微技术合作发展次微米级金粒子图案转印及接合技术
田中貴金屬工業與休斯微技術合作發展次微米級金粒子圖案轉印及接合技術
Tanaka Precious Metals and SUSS MicroTec to Jointly Develop Sub-micron Gold Particle Pattern Transfer and Bonding Technology
Monday, July 11, 2011
다나까전자공업, 동(Cu)본딩 와이어를 3개 거점에서 생산
田中电子工业三大据点生产铜Bonding Wire分散供给风险,促使产能倍增
田中電子工業三大據點生產銅Bonding Wire分散供給風險,促使產能倍增
Tanaka Precious Metals to Start Producing Copper Bonding Wire in 3 Locations
Monday, June 13, 2011
다나까 전자공업, Silver Bonding Wire 판매 개시
田中電子工業開始銷售銀合金接合線

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