English | 简体中文 | 繁體中文 | 한국어 | 日本語
Wednesday, 15 May 2024, 14:30 JST
Share:
    

Source: Honda Motor Co, Ltd
Honda and IBM sign Memorandum of Understanding to Explore Long-term Joint Research and Development of Semiconductor Chip and Software Technologies for Future Software-Defined Vehicles
Agreement outlines intent to research and develop solutions to new challenges related to processing performance, power consumption, and design complexity

TOKYO, Japan / ARMONK, N.Y., U.S.A., May 15, 2024 - (JCN Newswire) - Honda Motor Co., Ltd. (Honda) today announced that Honda and IBM have signed a Memorandum of Understanding (MOU) outlining their intent to collaborate on the long-term joint research and development of next-generation computing technologies(1) needed to overcome challenges related to processing capability, power consumption, and design complexity for the realization of the software-defined vehicles (SDV) of the future.

The application of intelligence/AI technologies is expected to accelerate widely in 2030 and beyond, creating new opportunities for the development of SDVs. Honda and IBM anticipate that SDVs will dramatically increase the design complexity, processing performance, and corresponding power consumption of semiconductors compared to conventional mobility products. In order to solve anticipated challenges and realize highly-competitive SDVs, it is critical to develop capabilities in the independent research and development of next-generation computing technologies. Based on this understanding, the two companies began considering long-term joint research and development opportunities.

In particular, the MOU outlines areas of potential joint research of specialized semiconductor technologies such as brain-inspired computing(2) and chiplet technologies, with the aim to dramatically improve processing performance while, simultaneously, decreasing power consumption. Hardware and software co-optimization is important to ensure high performance and fast time to market. To achieve such benefits and manage design complexity for future SDVs, the two companies also plan to explore open and flexible software solutions. 

Through this collaboration, the two companies would strive to realize SDVs that feature the world’s top-level computing and power saving performance.

(1) Computing technology being developed with an aim to achieve both high processing performance and low power consumption in the 2030s and beyond.
(2) Computer architecture and algorithms that mimic the brain's structure and function while optimizing for silicon.



Topic: Press release summary
Source: Honda Motor Co, Ltd

Sectors: Electronics, Automotive, EVs, Transportation
https://www.acnnewswire.com
From the Asia Corporate News Network


Copyright © 2024 ACN Newswire. All rights reserved. A division of Asia Corporate News Network.

 
Honda Motor Co, Ltd Links

http://www.honda.com

https://plus.google.com/110355594819754396833

https://www.facebook.com/HondaJP

https://twitter.com/HondaJP

https://www.youtube.com/user/HondaJPPR

https://jp.linkedin.com/company/honda

Honda Motor Co, Ltd Related News
Tuesday, 24 December 2024, 11:18 JST
Nissan and Honda sign MOU to consider business integration
Tuesday, 24 December 2024, 10:54 JST
Nissan, Honda, and Mitsubishi Motors sign MOU on collaborative considerations
Tuesday, 24 December 2024, 10:23 JST
GAC Honda Begins Operation of New Energy Vehicle (NEV) Production Factory in Guangzhou, China
2024年12月23日 17時00分 JST
日産自動車・Honda・三菱自動車、3社協業形態の検討に関する覚書を締結
2024年12月23日 11時30分 JST
広汽Hondaの開発区新エネルギー車工場が稼働開始
More news >>
Copyright © 2024 ACN Newswire - Asia Corporate News Network
Home | About us | Services | Partners | Events | Login | Contact us | Cookies Policy | Privacy Policy | Disclaimer | Terms of Use | RSS
US: +1 214 890 4418 | China: +86 181 2376 3721 | Hong Kong: +852 8192 4922 | Singapore: +65 6549 7068 | Tokyo: +81 3 6859 8575