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| Press Releases |
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| Friday, November 12, 2010 |
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田中貴金屬工起於日本國內首度推出使用效 率約為以往3倍的銀系大型圓筒濺鍍靶材 |
| TANAKA HOLDINGS Co., Ltd.（總公司：千代田區丸之内、代表取締役社長：岡本英彌）發表，日本國內首次針對矽薄膜太陽電池※2 的銀薄膜形成之銀系大型圓筒濺鍍靶材※3。將從2010年11月10日（星期三）起，由田中貴金屬集團內負責製造的田中貴金屬工業株式會社（總公司：千代田區丸之內、代表取締役社長：岡本英彌）開始供應。 more info >> |
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| Thursday, September 10, 2015 |
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Electroplating Engineers of Japan Establishes Local Subsidiary in Shanghai |
| Tanaka Holdings Co., Ltd. today announced that Electroplating Engineers of Japan, Limited, which operates the Tanaka Precious Metals' plating business will establish EEJA Shanghai as a local subsidiary in Shanghai in order to expand and enhance the plating business in China, with operations set to start on September 10. more info >> |
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일본 일렉트로플레이팅 엔지니어즈(EEJA), 중국 상해에 현지 법인을 설립 |
| TANAKA 홀딩스 주식회사는 TANAKA 귀금속 그룹의 도금사업을 전개하는 일본 일렉트로플레이팅 엔지니어즈 주식회사가 중국 시장에서의 도금 사업 확대, 강화를 목적으로 상해에 현지 법인으로 EEJA 상해를 설립하고 9월10일(목)부터 업무 개시한다는 것을 발표합니다. more info >> |
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日本電鍍工程株式會社（EEJA）於上海設立當地法人 |
| 田中控股株式會社宣布田中貴金屬集團電鍍業務發展之日本電鍍工程株式會社以擴大與強化中國市場電鍍事業為目的，於上海設立當地法人EEJA上海，並自9月10日（四）起開始運作。 more info >> |
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日本电镀工程株式会社（EEJA）在上海设立当地法人 |
田中控股株式会社宣布,为扩大及强化中国市场的电镀业务，将由开展田中贵金属集团电镀业务的日本电镀工程株式会社于上海设立当地法人--EEJA上海，自9月10日（四）起开始运作。
more info >> |
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| Tuesday, July 28, 2015 |
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일본 일렉트로플레이팅 엔지니어스(EEJA), 대량생산 기계와 동일한 도금 형성이가능한 반도체 웨이퍼 컵식 초소형 도금 실험장치를 7월 15일부터 판매 개시 |
| TANAKA 홀딩스 주식회사는 TANAKA 귀금속 그룹의 도금사업을 전개하는 일본 일렉트로플레이팅 엔지니어스 주식회사가 대량생산 기계와 동일한 피막을 실현하는 반도체 웨이퍼용 컵식 초소형 도금 실험장치 'RAD-Plater'를 개발하여 7월15일부터 판매한다는 것을 발표합니다. more info >> |
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日本電鍍工程株式會社(EEJA)於7月15日開始販售可形成和量產機型相同電鍍層的半導體晶圓鍍杯式超小型電鍍實驗裝置 |
| 田中控股株式會社宣布田中貴金屬集團電鍍業務發展之日本電鍍工程株式會社已開發出可形成與量產機型相同電鍍皮膜的半導體晶圓用的鍍杯式超小型電鍍實驗裝置—「RAD-Plater」，並於7月15日開始販售。 more info >> |
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日本电镀工程株式会社(EEJA)于7月15日开始销售可形成和量产机型相同电镀层的半导体晶圆杯式超小型电镀实验设备 |
| 田中控股株式会社宣布田中贵金属集团电镀业务发展之日本电镀工程株式会社已开发出可形成与量产机型相同电镀皮膜的半导体晶圆用的杯式超小型电镀实验设备—“RAD-Plater”，并于7月15日开始销售。 more info >> |
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| Thursday, July 16, 2015 |
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Correction: Electroplating Engineers of Japan Launches Semiconductor Wafer Cup-type Ultra-compact Plating Laboratory Equipment on July 15, Enabling Plating Equivalent to Mass Production Machines |
| Tanaka Holdings Co., Ltd. today announced that Electroplating Engineers of Japan, Limited has developed, and launched from July 15, the RAD-Plater cup-type ultra-compact plating laboratory equipment for semiconductor wafers, which achieves equivalent films to mass-production machines. more info >> |
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| Wednesday, July 15, 2015 |
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Electroplating Engineers of Japan Launches Semiconductor Wafer Cup-type Ultra-compact Plating Laboratory Equipment on July 15, Enabling Plating Equivalent to Mass Production Machines |
Tanaka Holdings Co., Ltd. today announced that Electroplating Engineers of Japan, Limited has developed, and launched from July 15, the RAD-Plater cup-type ultra-compact plating laboratory equipment for semiconductor wafers, which achieves equivalent films to mass-production machines.
more info >> |
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| Latest Press Releases |
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Blueberry Rebrand Reflects Exciting New Era for the Forex Company
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ULVAC Launches Oil Rotary Vacuum Pump Gv135
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